Manual Semiconductor Metrology System
Cost-effective alternative to full-automated wafer measurement and inspection systems
Product can provide measurement of thickness and bow of all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and sapphire or tape
- Front USB port enables easy storage of measurements and other data to flash drives
- MTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability
- Non-contact measurements
- 76-300 mm diameter wafer range
- Optional wafer measurement rings
- Wafer stops for exact centering
- Ethernet interface
- Full remote control software (Windows compatible)
- Optional calibration wafers
| Product Info | Technical Specifications | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| P/N | Model | Measurement Range | Accuracy | Resolution | Interface | Type | Frequency Response | Request Info | ||||
| 8000-6760-001 | Proforma 300i | 1700µm (66.9mil/s) | ±0.25 µm | 0.05µm | RS232 and Ethernet | Desktop System | 16.6Hz | Request Infomation on Proforma 300i | ||||
| 8000-6760-002 | Proforma 300Gi | 1700µm (66.9mil/s) | ±0.25 µm | 0.05µm | RS232 and Ethernet | Desktop System | 16.6Hz | Request Infomation on Proforma 300Gi | ||||
| Not finding what you’re looking for? MTI offers custom solutions More Info About MTI’s Custom Solutions | ||||||||||||
| Industry | Measurement Type | Applications |
|---|---|---|
| Semiconductor | Thickness | GaAs substrate thickness measurement |
| Semiconductor | Surface | Wafer Thickness, Bow, Warp and TTV |
| Semiconductor | Surface | Wafer QA/QC after slicing and polishing |
| Semiconductor | Surface | Wafer Characterization |
300i Tutorial
MTI 300i: Measuring different Types of Wafers
MTI 300i – Measurement of glass thickness with Proforma 300i
Measuring various wafers with the 300i
Metrology Product Family Video
Proforma 300i SA Semi Automated Measurement Tool – Watch Now
Wafer TTV, thickness and bow measurement: Wafer characterization demonstration using MTI Proforma 300iSA – Watch Now
Proforma 300iSA Startup: Quickstart for Proforma 300iSA – Watch Now
Proforma 300iSA – How to guide: Features and usage of Proforma 300iSA – Watch Now
Operating the Proforma 300iSA Semi-automated Metrology System – Watch Now
Creating a Recipe File for the Proforma 300iSA – Watch Now
Creating a Compensation File for a Recipe for the Proforma 300iSA – Watch Now
The Proforma 300i wafer thickness gauge is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types. The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.
*Gallium-Arsenide requires probe reconfiguration for semi-insulating materials over 10K-Ohm cm bulk resistance.
Accessories
| P/N | Image | Model | Product Description |
|---|---|---|---|
| 8000-6563 |  | Base Rings | 50.8mm (2″) Base rings are required for BOW measurements |
| 8000-6552 |  | Base Rings | 76.2mm (3″) Base rings are required for BOW measurements |
| 8000-6548 |  | Base Rings | 100mm (4″) Base rings are required for BOW measurements |
| 8000-6553 |  | Base Rings | 125mm (5″) Base rings are required for BOW measurements |
| 8000-6564 |  | Base Rings | 152.4mm (6″) Base rings are required for BOW measurements |
| 8000-6565 |  | Base Rings | 203.25mm (8″) Base rings are required for BOW measurements |
| 2000-2000 |  | Calibration Standard | Silicon (Si) wafer |
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