Semi-automated Metrology System
Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
Measures Thickness, TTV, Bow, Warp, Site and Global Flatness.
- Exclusive MTI capacitance sensors for outstanding accuracy and repeatability
- Full 1000 µm thickness measurement range without re-calibration
- Measures Thickness, TTV, Bow, Warp and site and Global Flatness
- Windows® user interface
- ASTM Standard measurements
- SEMI S2-0200 health and safety compliant design
- SEMI S8-0999 ergonomic compliant design
- Measures all materials including Si, GaAs, Ge, InP, SiC ***
*** provided bulk resistivity is less than 20K Ohm/cm
| Specification | Range | Accuracy | |
|---|---|---|---|
| Thickness | ASTM F533 | +/- 500 µm | +/- 0.25 µm |
| TTV | ASTM F657 | +/- 500 µm | +/- 0.25 µm |
| Bow | ASTM F534 | +/- 250 µm | +/- 2.0 µm |
| Warp | ASTM F1390 | +/- 250 µm | +/- 2.0 µm |
| Sori | ASTM F1451 | +/- 250 µm | +/- 2.0 µm |
| Flatness (Site) | ASTM F1530 | 8 mm * | +/- 0.15 µm |
| Flatness (Global) | ASTM F1530 | 8 mm * | +/- 0.15 µm |
| Industry | Measurement Type | Applications |
|---|---|---|
| Semiconductor | Surface | Wafer QA/QC after slicing and polishing |
Operating the Proforma 300iSA Semi-automated Metrology System
Creating a Recipe File for the Proforma 300iSA
Creating a Recipe File for the Proforma 300iSA
Metrology Product Family Video
Other Videos related to our Metrology Systems
- Proforma 300i SA Semi Automated Measurement Tool – Watch Now
- Wafer TTV, thickness and bow measurement: Wafer characterization demonstration using MTI Proforma 300iSA – Watch Now
- Proforma 300iSA Startup: Quickstart for Proforma 300iSA – Watch Now
- Proforma 300iSA – How to guide: Features and usage of Proforma 300iSA – Watch Now
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The Proforma 300iSA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII’s exclusive Push-Pull capacitance technology, the Proforma 300iSA delivers full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images.
Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.
- Wafer Specifications Diameter: 150 mm, 200 mm, 300 mm
- Material: All semiconducting and semi-insulating wafers including Si, GaAs, Ge, SiC, InP
- Surfaces: As-Cut, Lapped, Etched, Polished, Patterned
- Flat/Notch: All SEMI Standard Flat(s) or Notch
- Conductivity: P or N Type
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Download drawings, documentation or software
Download How to Avoid 5 Common Mistakes in Wafer Measurement Accuracy
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